VME总线 64C3

NAI’s 64C3 is a 6U VME multifunction I/O and communication master or slave (user selectable) control board with six function module slots that can be configured with a variety of I/O and communication functions. Using multiple DSPs, the enhanced motherboard enables higher processing power and dedicated pre-processing control for each module.

By eliminating the need for multiple, specialized, single-function boards, this unique design increases packaging density, saves enclosure slots, and reduces power consumption. The 64C3, a low-power/high-performance board, is ideally suited for rugged defense, industrial, and commercial applications.

In a VME chassis, the 64C3 acquires sensor measurement data and controls simulation signals, and makes this information available to an external host processor via Gigabit Ethernet (Gig-E) or PCIe. Preexisting, fully-tested functions can be quickly and easily combined in an unlimited number of ways. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.

The 64C3 includes Software Support Kits (SSKs) for multiple operating systems. In addition, SSKs are supplied with source code and board-specific library I/O APIs to facilitate system integration.

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  • 6U VME with Master VME Bus capability
  • Support for 6 independent, intelligent function modules
  • A variety of I/O and communication modules to choose from
  • Control via either VME Bus or dual Gigabit Ethernet (Gig-E) interfaces
  • Connections via front panel, rear panel, or both
  • Automatic Background Built-in-Test (BIT) (module dependent)
  • Software Support Kits (SSKs) and drivers available
  • Commercial and rugged models
  • Operating temperature: 0° C to 70° C commercial, or -40° C to +85° C rugged
  • 6U VME with Master VME Bus capability
  • Support for 6 independent, intelligent function modules
  • A variety of I/O and communication modules to choose from
  • Control via either VME Bus or dual Gigabit Ethernet (Gig-E) interfaces
  • Connections via front panel, rear panel, or both
  • Automatic Background Built-in-Test (BIT) (module dependent)
  • Software Support Kits (SSKs) and drivers available
  • Commercial and rugged models
  • Operating temperature: 0° C to 70° C commercial, or -40° C to +85° C rugged

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